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Top-side cooling simplifies design and reduces cost for compact power solutions.
November 23, 2022
By: DAVID SAVASTANO
Editor, Ink World Magazine
onsemi announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. The company showed the new devices at electronica, the world’s leading trade fair and conference for electronics. Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heat...
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